Wafer processing method and apparatus
US9837291B2 · kind B2 · utility
6Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2014 |
| Grant date | Dec 5, 2017 |
| Priority date | — |
| Expiry date | Jan 24, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for and a method of bonding a first substrate and a second substrate are provided. In an embodiment a first wafer chuck has a first curved surface and a second wafer chuck has a second curved surface. A first wafer is placed on the first wafer chuck and a second wafer is placed on a second wafer chuck, such that both the first wafer and the second wafer are pre-warped prior to bonding. Once the first wafer and the second wafer have been pre-warped, the first wafer and the second wafer are bonded together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.