Assembly methods of a SMA assembly and an OIS device
US9841609B1 · kind B1 · utility
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10Claims
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Key dates
| Filing date | Jun 28, 2016 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Jun 28, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03B2205/0076
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An assembly method of a SMA assembly, includes disposing a lens holder unit on a SMA unit, the lens holder unit being provided with a first spring, a lens holder and a coil that are mounted on the first spring, with the first spring pressed against a mounting surface of the SMA unit; and bonding the first spring of the lens holder unit with the mounting surface of the SMA unit. The assembly process is simplified, the coating and soldering space become big to facilitate the bonding process, and the joining force between the SMA unit and the lens holder unit is enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.