Jian He
4Patents
1h-index
14Co-inventors
37Inventor score
Filing activity: Oct 31, 2013 → Nov 13, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9627295B2 | Devices, systems and methods for manufacturing through-substrate vias and front-side structures | Electricity | 1 | Active |
| US12334589B2 | Bipolar structures for use with electrochemical devices, and associated systems and methods | Emerging Cross-Sectional Technologies | 0 | Active |
| US9841609B1 | Assembly methods of a SMA assembly and an OIS device | Physics | 0 | Active |
| US9305865B2 | Devices, systems and methods for manufacturing through-substrate vias and front-side structures | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.