Method for thinning samples
US9842742B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2016 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Oct 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68354
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for thinning samples including the steps of: a) providing at least one sample having a front and a rear face, b) providing a frame substrate having a first face and a second face opposite the first, including a through-opening which opens into the first and second face, which is configured to receive the sample, c) positioning the sample so it is disposed in the through-opening, the front face being oriented to the same side as the first face, and d) thinning the frame substrate and the sample simultaneously from the first face and the front face, respectively, so that at the end of thinning, the faces extend substantially in the same plane, the thinning being carried out using a grinder, the frame substrate and the sample being disposed on a rotary disk held in place by aspiration, the flanks of the sample remaining free during the thinning.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.