Semiconductor device and method of manufacture
US9842826B2 · kind B2 · utility
13Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2015 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Jul 15, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated fan out package on package architecture is utilized along with a reference via in order to provide a reference voltage that extends through the InFO-POP architecture. If desired, the reference via may be exposed and then connected to a shield coating that can be used to shield the InFO-POP architecture. The reference via may be exposed by exposing either a top surface or a sidewall of the reference via using one or more singulation processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.