Radiant heat circuit board and method for manufacturing the same
US9844142B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2011 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Jan 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0369
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.