Method for producing soft magnetic film laminate circuit board
US9844147B2 · kind B2 · utility
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2Claims
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Key dates
| Filing date | Apr 14, 2014 |
| Grant date | Dec 12, 2017 |
| Priority date | — |
| Expiry date | Jun 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/085
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board includes the steps of bringing a soft magnetic thermosetting film containing soft magnetic particles, having a porosity of 15% or more and 60% or less, and in a semi-cured state into contact with the one side of the circuit board and bringing the soft magnetic thermosetting film into a cured state by vacuum hot pressing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.