Patent · US Active

Method for stacking electronic components

US9847175B2 · kind B2 · utility

0Cited by

7References

30Claims

0Family size

Assignee

KEMET Electronics Corporation · US

Inventors

Maurice Perea · Simpsonville, US
R Allen Hill · Simpsonville, US
Reggie Phillips · Simpsonville, US

Key dates

Filing date	Jan 10, 2014
Grant date	Dec 19, 2017
Priority date	—
Expiry date	Nov 15, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/43
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.