Resin composition, copper clad laminate and printed circuit board using same
US9850375B2 · kind B2 · utility
1Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2013 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Aug 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/012
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.