Heat exchanger construction using low temperature sinter techniques
US9851161B2 · kind B2 · utility
0Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2012 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Feb 14, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Some embodiments relate to constructing a heat exchanger using nanoink as a thermal bond interface between portions of the heat exchanger. The heat exchanger may comprise fins and at least one base. A nanoink may be applied to at least a portion of the fins. The pieces of the heat exchanger may be sintered such that the nanoink melts and forms a bond between the pieces of the heat exchanger. Some embodiments include a second base. Some embodiments incorporate dissimilar materials within the heat exchanger construction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.