Substrate processing apparatus, substrate processing method, and recording medium
US9852933B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2015 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Apr 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heating processing performed on an outer peripheral portion of a substrate can be optimized. A substrate processing apparatus includes a holding unit configured to hold a substrate; a rotation unit configured to rotate the holding unit; a processing liquid supply unit configured to supply a processing liquid onto the substrate held in the holding unit; and a heating device configured to heat an outer peripheral portion of the substrate held in the holding unit. Further, the heating device includes a discharge flow path through which a gas is discharged toward the outer peripheral portion of the substrate held in the holding unit; a branch flow path through which a gas is discharged toward a region other than the substrate held in the holding unit; and a heating unit configured to heat the discharge flow path and the branch flow path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.