Wafer processing method
US9852949B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2016 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Sep 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/6834
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer is divided into device chips each of which is surrounded by a mold resin. The wafer has a plurality of devices arranged like a matrix with a spacing having a predetermined width, the front side of each device being covered with the mold resin, the spacing being filled with the mold resin to form a street between any adjacent ones of the devices. The wafer processing method includes a division start point forming step of forming a division start point along each street at the lateral center of the mold resin filling the spacing and a dividing step of applying an external force to the wafer after performing the division start point forming step, thereby laterally dividing each street into two parts at the division start point to obtain the device chips divided from each other, each device chip being surrounded by the mold resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.