Packaged semiconductor device having an encapsulated semiconductor chip
US9852961B2 · kind B2 · utility
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5References
6Claims
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Key dates
| Filing date | Aug 28, 2013 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Aug 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor device includes a semiconductor component, first and second heat dissipation means disposed between the semiconductor component and the first and second main faces, respectively, encapsulated by an encapsulant, the shape of the packaged semiconductor device being non-rectangular cuboid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.