Conductive terminal on integrated circuit
US9852985B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2016 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Sep 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05647
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductive terminal on an integrated circuit is provided. The conductive terminal includes a conductive pad, a dielectric layer, and a conductive via. The conductive pad is disposed on and electrically to the integrated circuit. The dielectric layer covers the integrated circuit and the conductive pad, the dielectric layer includes a plurality of contact openings arranged in array, and the conductive pad is partially exposed by the contact openings. The conductive via is disposed on the dielectric layer and electrically connected to the conductive pad through the contact openings. The conductive via includes a plurality of convex portions arranged in array. The convex portions are distributed on a top surface of the conductive via, and the convex portions are corresponding to the contact openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.