Integrated substrate defect detection using precision coating
US9859138B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 20, 2014 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Dec 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/24
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Apparatuses and methods for improved substrate defect detection is provided. Substrate defects may be detected, possibly with defect detection equipment such as laser metrology equipment. Defects smaller than the detection limit of the detection equipment may be decorated with a layer of material to increase the effective sizes of the defects. The thickness and composition of the material deposited may be tuned depending on the composition of the substrate and the defects. The composition of the detected defects may be identified with defect identification equipment. The defect identification equipment may be an electron generating apparatus and the composition of the defects may be identified from the interaction of the electrons with the defect. The deposited material may be removed either before or during the defect identification phase to aid in the identification of the defect composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.