Edge seal for lower electrode assembly
US9859142B2 · kind B2 · utility
4Cited by
109References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2011 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Jul 13, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.