Method for bonding substrates
US9859246B2 · kind B2 · utility
5Cited by
1References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 18, 2014 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Dec 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06565
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.