Patent · US Active

Electronic device package

US9859255B1 · kind B1 · utility

3Cited by

4References

23Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Jh Yoon · Seoul, KR
Yong She · Shanghai, CN
Mao Guo · Shanghai, CN
Richard Patten · Minneapolis, US

Key dates

Filing date	Oct 1, 2016
Grant date	Jan 2, 2018
Priority date	—
Expiry date	Oct 1, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include a package substrate, an electronic component, a mold compound encapsulating the electronic component, and a redistribution layer disposed such that the mold compound is between the package substrate and the redistribution layer. The redistribution layer and the package substrate can be electrically coupled. In addition, the redistribution layer and the electronic component can be electrically coupled to electrically couple the electronic component and the package substrate. Associated systems and methods are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.