Patent · US Active

Semiconductor component comprising magnetic field sensor

US9859332B2 · kind B2 · utility

1Cited by

2References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Horst Theuss · Wenzenbach, DE
Albert Auburger · Regenstauf, DE

Key dates

Filing date	Jul 6, 2015
Grant date	Jan 2, 2018
Priority date	—
Expiry date	Jul 6, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH10N52/80
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The invention relates to a semiconductor component (100) comprising a semiconductor chip (10) configured as a wafer level package, a magnetic field sensor (11) being integrated into said semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.