Selective laser-assisted transfer of discrete components
US9862141B2 · kind B2 · utility
13Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2015 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Jun 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.