System and method for inspecting a wafer
US9863889B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2010 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Jun 22, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and a system for inspecting a wafer. The system comprises an optical inspection head, a wafer table, a wafer stack, a XY table and vibration isolators. The optical inspection head comprises a number of illuminators, image capture devices, objective lens and other optical components. The system and method enables capture of brightfield images, darkfield images, 3D profile images and review images. Captured images are converted into image signals and transmitted to a programmable controller for processing. Inspection is performed while the wafer is in motion. Captured images are compared with reference images for detecting defects on the wafer. An exemplary reference creation process for creating reference images and an exemplary image inspection process is also provided by the present invention. The reference image creation process is an automated process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.