Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
US9865490B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2016 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Oct 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.