Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication
US9870936B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2016 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Mar 3, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B5/00
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.