Contact area design for solder bonding
US9871013B2 · kind B2 · utility
6Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2014 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Dec 29, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package component includes a dielectric layer and a metal pad over the dielectric layer. A plurality of openings is disposed in the metal pad. The first plurality of openings is separated from each other by portions of the metal pad, with the portions of the metal pad interconnected to form a continuous metal region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.