Common deposition platform, processing station, and method of operation thereof

US9873945B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Neil MORRISON · Seeheim-Jugenheim, DE
• Jose Manuel DIEGUEZ-CAMPO · Hanau, DE
• Heike Landgraf · Bruchköbel, DE
• Tobias Stolley · Oberursel, DE
• Stefan Hein · Berlin, DE
• Florian RIES · Stuttgart, DE
• Wolfgang BUSCHBECK · Hanau, DE

Key dates

• Filing date: Apr 26, 2013
• Grant date: Jan 23, 2018
• Expiry date: Jun 2, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/3277
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

An apparatus includes a substrate support having an outer surface for guiding the substrate through a first vacuum processing region and at least one second vacuum processing region. First and second deposition sources correspond to the first processing region and at least one second deposition source corresponds to the at least one second vacuum processing region, wherein at least the first deposition source includes an electrode having a surface that opposes the substrate support. A processing gas inlet and a processing gas outlet are arranged at opposing sides of the surface of the electrode. At least one separation gas inlet how one or more openings, wherein the one or more openings are at least provided at one of opposing sides of the electrode surface such that the processing gas inlet and/or the processing gas outlet are provided between the one or more openings and the surface of the electrode.