Sensor self-diagnostics using multiple signal paths
US9874609B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Feb 1, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2829
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments relate to systems and methods for self-diagnostics and/or error detection using multiple signal paths in sensor and other systems. In an embodiment, a sensor system comprises at least two sensors, such as magnetic field sensors, and separate signal paths associated with each of the sensors. A first signal path can be coupled to a first sensor and a first digital signal processor (DSP), and a second signal path can be coupled to a second sensor and a second DSP. A signal from the first DSP can be compared with a signal from the second DSP, either on-chip or off, to detect faults, errors, or other information related to the operation of the sensor system. Embodiments of these systems and/or methods can be configured to meet or exceed relevant safety or other industry standards, such as safety integrity level (SIL) standards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.