Signal via positioning in a multi-layer circuit board using a genetic via placement solver
US9875331B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2017 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Feb 13, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
One aspect includes identifying via groups that each includes a ratio of a plurality of signal vias to one ground via based on a design file defining a layout of a multi-layer circuit board. A genetic via placement solver iteratively evaluates potential placement solutions that adjust a placement of one or more of the signal vias until at least one solution is identified that meets one or more placement criteria of the signal vias. The genetic via placement solver performs a mutation and recombination of one or more solutions that do not meet the one or more placement criteria and re-evaluates the one or more solutions that do not meet the one or more placement criteria. The design file is modified to include at least one shifted signal via position based on identifying the at least one solution that meets the one or more placement criteria.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.