Package wafer processing method
US9875948B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2017 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Jan 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54453
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package wafer processing method includes a processing step of processing a package wafer along planned dividing lines by a laser beam irradiation unit and forming processing grooves in the package wafer. The processing step includes detecting a processing groove and an exposed key pattern closest to the planned dividing line corresponding to the processing groove at a predetermined timing and measuring, as a deviation amount, the difference between the distance from the processing groove to the exposed key pattern and the distance that is registered in a registration step and is from the planned dividing line corresponding to the processing groove to the closest key pattern. An indexing feed mechanism is corrected according to the deviation amount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.