System and method for managing semiconductor manufacturing defects
US9880892B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2014 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Feb 28, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2849
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of managing semiconductor manufacturing defects, the method including: determining a cumulative aging parameter for each of a plurality of first IC products produced with a particular manufacturing line, the cumulative aging parameter being dependent on a product operating condition; calculating an observed defect rate for the plurality of first IC products based on a difference between a predicted value of a aging parameter and the cumulative aging parameter for each of the plurality of first IC products; and adjusting a manufacturing reliability model for the particular manufacturing line in response to the observed defect rate being different from an initial predicted defect rate for the plurality of first IC products wherein the manufacturing reliability model reestablishes the initial predicted defect rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.