Body tie optimization for stacked transistor amplifier
US9882531B1 · kind B1 · utility
36Cited by
13References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2016 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Sep 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/75
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A transistor stack can include a combination of floating and body tied devices. Improved performance of the RF amplifier can be obtained by using a single body tied device as the input transistor of the stack, or as the output transistor of the stack, while other transistors of the stack are floating transistors. Transient response of the RF amplifier can be improved by using all body tied devices in the stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.