Semiconductor wafer handling transport
US9884726B2 · kind B2 · utility
16Cited by
365References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2014 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | May 24, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.