Module testing utilizing wafer probe test equipment

US9885748B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Martin Eckert · Metzingen, DE
• Eckhard Kunigkeit · Stuttgart, DE
• Quintino L. Trianni · Balingen, DE
• Christian Zoellin · Waiblingen, DE

Key dates

• Filing date: Jun 9, 2015
• Grant date: Feb 6, 2018
• Expiry date: Jul 13, 2036

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2867
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A module plate is provided for use with a wafer handler and testing mechanism. The module plate has a diameter equivalent to an integrated circuit wafer and a height equivalent to or less than a height of a module lid associated with each module in a plurality of modules associated with the module plate. The module plate has a plurality of cutouts in the module plate that have a width equivalent to a width of the module lid and at least a length equivalent to a length of the module lid. The height of the module plate is such that, when a test head contacts a module base of each module in a plurality of modules, the module lid contacts a chuck on which the module plate resides during testing of the module thereby providing resistance in order to accurately test the module.