Inventor · Metzingen, DE

Martin Eckert

57Patents
6h-index
81Co-inventors
71Inventor score

Filing activity: Jun 1, 2001 → Jan 10, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US7322746B2 X-ray sensitive camera comprising two image receivers and X-ray device Human Necessities 67 Expired
US7559692B2 X-ray sensitive camera comprising two image receivers and X-ray device Human Necessities 57 Active
US7949517B2 Dialogue system with logical evaluation for language identification in speech recognition Physics 18 Active
US7747428B1 Visibly distinguishing portions of compound words Physics 11 Active
US6695747B2 Transmission mechanism comprising a shifting device Emerging Cross-Sectional Technologies 10 Expired
US10082419B1 Adjustable load transmitter Physics 6 Active
US6341093B1 SOI array sense and write margin qualification Physics 6 Expired
US6997075B2 Motor vehicle with a gearbox and method for operating a motor vehicle Emerging Cross-Sectional Technologies 6 Expired
US10082526B1 Probe card alignment Physics 5 Active
US10146144B1 Adjustable load transmitter Physics 5 Active
US8126703B2 Method, spoken dialog system, and telecommunications terminal device for multilingual speech output Electricity 5 Active
US9804231B2 Power noise histogram of a computer system Physics 5 Active
US9183833B2 Method and system for adapting interactions Physics 5 Active
US8535956B2 Chip attach frame Emerging Cross-Sectional Technologies 4 Active
US9740813B1 Layout effect characterization for integrated circuits Physics 4 Active
US9977053B2 Wafer probe alignment Physics 4 Active
US10345136B2 Adjustable load transmitter Physics 4 Active
US7051609B2 Transmission mechanism comprising a shifting device Emerging Cross-Sectional Technologies 3 Expired
US9892789B1 Content addressable memory with match hit quality indication Physics 2 Active
US7466716B2 Reducing latency in a channel adapter by accelerated I/O control block processing Electricity 2 Active
US9885748B2 Module testing utilizing wafer probe test equipment Physics 2 Active
US8180142B2 Test fail analysis on VLSI chips Physics 2 Active
US9401222B1 Determining categories for memory fail conditions Physics 2 Active
US9927463B2 Wafer probe alignment Physics 2 Active
US9496188B2 Soldering three dimensional integrated circuits Electricity 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.