Substrate warpage control using temper glass with uni-directional heating
US9887110B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2014 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | Sep 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method including clamping an integrated circuit package substrate between first and second supporting substrates; exposing the clamped package substrate to a heat source from a single direction; and modifying a shape of the package substrate. An apparatus including a first and second supporting substrates, the first supporting substrate including a two-dimensional area that is 75 percent to 95 percent of the area of the first side of the package substrate and the second supporting substrate including a two-dimensional area that is at least equivalent to the area of a package substrate and each of the first supporting substrate and the second supporting substrate include a body having a cavity therein such that when assembled on opposite sides of a package substrate, each cavity has a volume dimension such that the body of the supporting substrate is not in contact with an area of a package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.