Die mounting system and die mounting method
US9887111B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2014 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | Mar 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/7598
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a die mounting system in which a die supply device is set on a component mounter and dies supplied from a die supply device are mounted on a circuit board by a mounting head of the component mounter, the position of a die is recognized by processing an image of the die on a dicing sheet captured by a camera, a supply head is moved to a die pickup position by a supply head moving mechanism, the die is picked up, the supply head is vertically inverted and moved to a die transfer position, and the die held by the supply head is picked up by a mounting head of the component mounter at a component transfer position and mounted on the circuit board. The die transfer position is set at a position such that die transfer and die imaging are able to be performed in parallel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.