Method and apparatus for processing wafer-shaped articles
US9887122B2 · kind B2 · utility
0Cited by
8References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2016 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | May 6, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an apparatus for treating a wafer-shaped article, a spin chuck is configured to hold a wafer-shaped article of a predetermined diameter. A non-rotating plate is positioned relative to the spin chuck such that the non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on the spin chuck. A fluid dispensing nozzle passes through the non-rotating plate and terminates in a discharge end positioned above and adjacent to the non-rotating plate. The discharge end comprises a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of the non-rotating plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.