Methods for forming a patterned structure in a sensor
US9891770B2 · kind B2 · utility
2Cited by
17References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2015 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Jul 15, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04111
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A sensor includes a patterned compliant layer positioned between two substrates. Each substrate can include one or more conductive electrodes, with each electrode of one substrate paired with a respective electrode of the other substrate. Each pair of conductive electrodes forms a capacitor. Several methods are disclosed that can be used to produce the patterned compliant layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.