Diodes offering asymmetric stability during fluidic assembly
US9892944B2 · kind B2 · utility
9Cited by
28References
39Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 23, 2016 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Jun 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/84
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.