Method of forming an array of a multi-device unit cell
US9893041B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2017 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Apr 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Backplane-side bonding structures including a common metal are formed on a backplane. Multiple source coupons are provided such that each source coupon includes a transfer substrate and an array of devices to be transferred. Each array of devices are arranged such that each array includes a unit cell structure including multiple devices of the same type and different types of bonding structures including different metals that provide different eutectic temperatures with the common metal. Different types of devices can be sequentially transferred to the backplane by sequentially applying the supply coupons and selecting devices providing progressively higher eutectic temperatures between respective bonding pads and the backplane-side bonding structures. Previously transferred devices stay on the backplane during subsequent transfer processes, enabling formation of arrays of different devices on the backplane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.