Substrate liquid treatment apparatus, substrate liquid treatment method and storage medium
US9897919B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 3, 2016 |
| Grant date | Feb 20, 2018 |
| Priority date | — |
| Expiry date | Aug 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A substrate liquid treatment method includes: (a) rotating the substrate about the vertical axis; (b) supplying the treatment liquid to the rotating substrate from the second nozzle with a falling point of the treatment liquid supplied from the second nozzle moving from the central portion to the peripheral portion of the substrate, while supplying the treatment liquid to the central portion of the substrate from the first nozzle, (c) after (b), moving the second nozzle from the peripheral portion to the central portion of the substrate with the supplying of the treatment liquid from the second nozzle being stopped, while continuing supplying the treatment liquid to the central portion of the rotating substrate from the first nozzle; and (d) after (c), supplying the treatment liquid to the rotating substrate from the second nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.