Patent · US Active

Method and apparatus to configure thermal design power in a microprocessor

US9898067B2 · kind B2 · utility

2Cited by

7References

8Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Eric Distefano · Livermore, US
Guy M. Therien · Beaverton, US
Vasudevan Srinivasan · Hillsboro, US
Tawfik M. Rahal-Arabi · Tigard, US
Venkatesh Ramani · Milpitas, US
Ryan D. Wells · Folsom, US
Stephen H. Gunther · Beaverton, US
Jeremy J. Shrall · Portland, US
James G. Hermerding, II · Vancouver, US

Key dates

Filing date	Apr 1, 2016
Grant date	Feb 20, 2018
Priority date	—
Expiry date	Apr 1, 2036

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02D10/00
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.