Integrated circuit device and method of manufacturing the same
US9899323B2 · kind B2 · utility
3Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2016 |
| Grant date | Feb 20, 2018 |
| Priority date | — |
| Expiry date | Dec 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B43/40
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device includes a first conductive line and a second conductive line that are spaced apart from each other and extend in a first direction to be parallel to each other; and a contact pad including a pad body including a first branch portion from which the first conductive line branches and a second branch portion from which the second conductive line branches and a loop branch portion that is located between the first branch portion and the second branch portion and protrudes from the pad body. Related devices and fabrication methods are also discussed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.