System for depositing one or more layers on a substrate supported by a carrier and method using the same

US9899635B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Stefan Bangert · Lauentheil, DE
• Uwe SCHÜßLER · Aschaffenburg, DE
• Jose Manuel DIEGUEZ-CAMPO · Hanau, DE
• Dieter Haas · Bruchköbel, DE

Key dates

• Filing date: Feb 4, 2014
• Grant date: Feb 20, 2018
• Expiry date: Feb 4, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K71/40
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.