Top electrode dome formation
US9905282B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2017 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | May 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N50/01
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods of fabricating a dome-shaped MTJ TE and the resulting devices are provided. Embodiments include forming a MRAM stack having a laterally separated MTJ structures and the MRAM and a logic stack each having a SiN layer; forming first trenches through the MRAM stack to a portion of the SiN layer above an MTJ structure; forming second trenches through the SiN layer fully landing on an upper portion of the MTJ structures and removing the SiN layer of the logic stack; forming a TaN layer over the MRAM and logic stack; removing portions of the TaN layer on opposite sides of the MTJ structures and therebetween; forming an oxide layer over the MRAM and logic stacks; and forming vias through the oxide layer of the MRAM stack down the TaN layer above MTJ structures and a via through the logic stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.