Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US9906700B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2017 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Mar 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.