Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB
US9907169B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2016 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Aug 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for forming an encapsulating mold compound into a molded solder mask on a bottom surface of a PCB is provided that allows the molded solder mask to have a very precise, preselected thickness, or height, while also ensuring that no gaps between the solder mask and side walls of the electrical contact pads exist. A circuit board and circuit board assembly that incorporate the molded solder mask are also provided. The molded solder mask is fabricated in such a way that overlap between the molded solder mask and the electrical contact pads and gaps between the molded solder mask and the side walls of the electrical contact pads are avoided. In addition, the molded solder mask allows the pitch between adjacent electrical contact pads to be greatly reduced compared to the pitch that is possible using a traditional solder mask formed by the traditional photolithographic approach.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.