Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole

US9908773B2 · kind B2 · utility

Assignees

• COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR
• EPCOS AG · DE

Inventors

• Damien Saint-Patrice · Valence, FR
• Arnoldus Den Dekker · Beuningen, NL
• Marcel Giesen · Munich, DE
• Florent Greco · Seyssinet-Pariset, FR
• Gudrun Henn · Ebenhausen, DE
• Jean-Louis Pornin · Crolles, FR
• Bruno Reig · Moirans, FR

Key dates

• Filing date: Dec 6, 2013
• Grant date: Mar 6, 2018
• Expiry date: Dec 6, 2033

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0145
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for packaging a microelectronic device in an hermetically sealed cavity and managing an atmosphere of the cavity with a dedicated hole, including making said cavity between a support and a cap layer such that a sacrificial material and the device are arranged in the cavity; removing the sacrificial material through at least one release hole, and hermetically sealing the release hole; making a portion of wettable material on the cap layer, around a blind hole or a part of said outside surface corresponding to a location of said dedicated hole; making a portion of fuse material on the portion of wettable material; making the dedicated hole by etching the cap layer; and reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole.