Substrate with integrated heat spreader
US9911678B2 · kind B2 · utility
1Cited by
3References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 17, 2016 |
| Grant date | Mar 6, 2018 |
| Priority date | — |
| Expiry date | Oct 17, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a substrate with an integrated heat spreader. The disclosed substrate includes a substrate core, at least one connecting structure, and a heat spreader. The substrate core has a top surface and a bottom surface opposite the top surface of the substrate. The at least one connecting structure extends through the substrate core from the top surface of the substrate core to the bottom surface of the substrate core. And the heat spreader extends through the substrate core from the top surface of the substrate core to a bottom level that is below the bottom surface of the substrate core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.