Magnetic small footprint inductor array module for on-package voltage regulator

US9911723B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Yongki Min · Phoenix, US
• Reynaldo A. Olmedo · Phoenix, US
• William J. Lambert · Chandler, US
• Kaladhar Radhakrishnan · Chandler, US
• Leigh E. Wojewoda · Tempe, US
• Venkat Anil K. Magadala · Fremont, US
• Clive R. Hendricks · Gilbert, US

Key dates

• Filing date: Dec 18, 2015
• Grant date: Mar 6, 2018
• Expiry date: Dec 18, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19042
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.