Reduction in large particle counts in polishing slurries
US9914852B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Aug 19, 2014 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Aug 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.